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  • Casting and Insolution Resin
Home > Encapsulation and Insulation Application > Casting and Insolution Resin
  • 208AB

    208AB is an epoxy adhesive for potting.It has low viscosity and defoaming fast, After heat-curing it's very transparent.IT's suitable for using in electric motors perfusion and filling.

    Product

    Mixing ratio

    (by weight)

    Gel Time

    Curing Scheme

    Tg*

    Application Properties

    208AB

    2:1

    < 30mins

    60℃/ 4hrs

    or

    25℃/ 24hrs

    87℃

    Clear coating and casting

     

     
  • 341AB

    341AB is two component epoxy adhesive and could cure fast at ambient temperature. It has good adhesion and chemicals resistance. The product is suitable for bonding between all kinds of materials and encapsulating of electric part.

     

    Product

    Mixing ratio

    (by weight)

    Gel Time

    Curing Scheme

    Tg*

    Application Properties

    341AB

    4:1

    < 40 mins

    80℃/ 2hrs

    81℃

    Capacitor Sealing

     
     
  • CST-003AB

    CST-003AB is an epoxy resin for potting.It has ultra low viscosity,defoaming fast and fast curing by middle temperature.It's very suitable for using in electronic products perfusion and filling.

    Product

    Mixing ratio

    (by weight)

    Gel Time

    Curing Scheme

    Tg*

    Application Properties

    CST-003AB

    2:1

    < 40 mins

    80℃/ 2hrs

    25℃/ 24hrs

    81℃

    Capacitor Sealing

     
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