-
208AB is an epoxy adhesive for potting.It has low viscosity and defoaming fast, After heat-curing it's very transparent.IT's suitable for using in electric motors perfusion and filling.
Product
Mixing ratio
(by weight)
Gel Time
Curing Scheme
Tg*
Application Properties
208AB
2:1
< 30mins
60℃/ 4hrs
or
25℃/ 24hrs
87℃
Clear coating and casting
-
341AB is two component epoxy adhesive and could cure fast at ambient temperature. It has good adhesion and chemicals resistance. The product is suitable for bonding between all kinds of materials and encapsulating of electric part.
Product
Mixing ratio
(by weight)
Gel Time
Curing Scheme
Tg*
Application Properties
341AB
4:1
< 40 mins
80℃/ 2hrs
81℃
Capacitor Sealing
-
CST-003AB is an epoxy resin for potting.It has ultra low viscosity,defoaming fast and fast curing by middle temperature.It's very suitable for using in electronic products perfusion and filling.
Product
Mixing ratio
(by weight)
Gel Time
Curing Scheme
Tg*
Application Properties
CST-003AB
2:1
< 40 mins
80℃/ 2hrs
25℃/ 24hrs
81℃
Capacitor Sealing
